Intel Corporation and 3D Glass Solutions have signed an MoU with the Odisha government to explore setting up an advanced semiconductor glass core packaging substrate facility in the state. The proposed project could position Odisha as a key semiconductor and AI infrastructure hub, boost India's manufacturing ambitions, attract global investments, and strengthen US-India technology collaboration.
Washington: Intel Corporation and 3D Glass Solutions have signed a memorandum of understanding with the Odisha government to explore establishing an advanced semiconductor glass core packaging substrate manufacturing facility, a move that could strengthen India's ambitions to become a global semiconductor hub.
The agreement was signed at Intel's headquarters in California's Santa Clara and is aimed at exploring the creation of a world-class facility focused on advanced semiconductor packaging technologies, a media statement said on Saturday.
If realised, the project would rank among the biggest technology investments in eastern India and could position Odisha as an emerging centre for semiconductor manufacturing, advanced packaging, artificial intelligence infrastructure, next-generation data centres and digital technologies.
The project remains subject to regulatory approvals, funding support from the state and Central governments, and other business conditions.
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