Udaipur, April 7, 2026 (Read) — Xiaomi has teased the launch of its upcoming smartphone Redmi K90 Max, which is expected to be unveiled later this month. The company has already confirmed several key features, highlighting a strong focus on gaming performance.
For the first time in the Redmi K series, the device will feature an active air-cooling system, designed to maintain performance during intensive gaming sessions. According to the company, the system can reduce the device temperature by up to 10 degrees Celsius within around 100 seconds under heavy load.
Xiaomi Group President Lu Weibing shared details through a post on Weibo, stating that the Redmi K90 Max will include a new cooling setup with a large 18.1mm fan. The company claims this fan is about 6 percent larger than standard solutions and can deliver 1.3 times higher air intake, helping keep the device cool during extended gaming sessions.
The cooling system uses a vertical air intake design along with forward-tilted fan blades to improve airflow management. It also includes a vortex-style air duct and metal guide fins, which direct air efficiently towards heat-generating components such as the chipset. Xiaomi claims this results in up to 40 percent better airflow utilisation.
The cooling mechanism has been optimised using AI-based simulations to enhance airflow paths and thermal efficiency. The company also noted improvements in noise control, stating that the fan will produce less sound compared to earlier implementations.
In terms of performance, the Redmi K90 Max is expected to feature a next-generation flagship processor with a dual-core performance architecture, although the exact chipset has not yet been revealed. The smartphone will come with a 165Hz refresh rate display, as confirmed by the company.
The device is being positioned specifically for e-sports and gaming, with enhancements in touch response, network performance, and audio output.
On the design front, the phone features a vertical dual rear camera setup located at the top-left corner of the back panel. An active cooling fan is also visible on the side of the device. The company has not yet announced the official launch date, but more details are expected in the coming days.
Bhupendra Singh Chundawat is a seasoned technology journalist with over 22 years of experience in the media industry. He specializes in covering the global technology landscape, with a deep focus on manufacturing trends and the geopolitical impact on tech companies. Currently serving as the Editor at Readhis insights are shaped by decades of hands-on reporting and editorial leadership in the fast-evolving world of technology.
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